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Chengde Technology Co.,Ltd

Booked for 1 upcoming

Chengde Technology Co.,Ltd is listed at 1 conference: 1 as an exhibitor. It is booked for PACK EXPO International 2026. Most of its events are in manufacturing.

Key facts

Where this company sponsors and exhibits.

Conference11 as exhibitor
Upcoming1next: PACK EXPO International
First listed20261 editions in total

Where Chengde Technology Co.,Ltd sponsors and exhibits

Newest first. Click a conference for its sponsors, exhibitors and prices.

ConferenceIndustryAsTier or booth
PACK EXPO International 2026
Oct 18–21, 2026 · Chicago, USA
ManufacturingExhibitorLL-10709

Questions

Which conferences does Chengde Technology Co.,Ltd sponsor or exhibit at?

Chengde Technology Co.,Ltd is listed at PACK EXPO International 2026.

Where is Chengde Technology Co.,Ltd exhibiting next?

PACK EXPO International (Oct 18–21, 2026).